Pull-Off Method for Different Adhesives in A Light Floor Heating System Volume 4 - Issue 1

Jacek Karpiesiuk*

• Expert in Construction and Building Specialties, Bialystok University of Technology, Poland

Received: March 01, 2021;   Published: March 18, 2021

*Corresponding author: Jacek Karpiesiuk, Bialystok University of Technology, Government Building Expert in Construction and Building Specialties, Member of the Polish Chamber of Civil Engineers, Wiejska str. 45A, 15-351, Poland

DOI: 10.32474/MAMS.2021.04.000176

Abstract PDF

To view the Full Article   Peer-reviewed Article PDF

Abstract

The light surface heating/cooling system (LSH/CS) creates a structure in which the surface of the thermal insulation is very often covered with metal heat diffusers. These are steel sheets, aluminum sheets, or aluminum foils with various thicknesses. Different types of floors are glued directly to them, no required screeds. For this purpose, you can use various types of adhesives dedicated by manufacturers to glue the thermal insulation layer with aluminum foil or metal heat diffusers with the floor. The most important parameter of the glued layers is their strength perpendicular to the face. It may depend on the influence of the temperature. To check this, various types of adhesives were tested by being put between thermal insulation and a layer of aluminum foil, between tiles and foil heat diffusers, as well as tiles and XPS boards without this foil, using the pull-off method at a temperature of 20-40 ˚C. This allowed us to determine the adhesion values of selected adhesives at the temperature level occurring in the LSH/CS system or light floor system (LFS). Ultimately, adhesives that met the conditions of high adhesion and easy application were selected. The research results may be useful for manufacturers and scientists dealing with the subject of structural or functional bonding of composites.

Keywords: Light floor system, Pull-off method, Aluminum heat diffusers, Thermal tests

Abstract| Introduction| Research Methodology| Conclusion| Acknowledgment References|